Aluminum Nitride Powder (AlN)

Aluminum Nitride Powder Price & List

Spec.	Purity	Shape	Available
AlN-ES001	＞95%	Spherical	D50 1-3 um
AlN-ES005	＞95%	Spherical	D50 5±1 um
AlN-ES010	＞95%	Spherical	D50 10±2 um
AlN-FS030	＞95%	Spherical	D50 30±3 um
AlN-MS050	＞95%	Spherical	D50 50±5 um
AlN-MS080	＞95%	Spherical	D50 80±5 um
AlN-MS100	＞95%	Spherical	D50 100±5 um
AlN-MS120	＞95%	Spherical	D50 120±5 um
AlN-CS150	＞95%	Spherical	D50 150±10 um
AlN-EF001	≥99%	Flaky	D50 1-2 um
AlN-MI500	≥99.7%	Irregular	-500 mesh
AlN-MI300	≥99.7%	Irregular	-300 mesh
AlN-MI200	≥99.7%	Irregular	-200 mesh
AlN-MI100	≥99.7%	Irregular	-100 mesh
Customizable	≥99.7%	Customizable	Sieve as required

Note: We provide customized service. If you don't find the powder you want, please send us an email directly. We can customize it according to your requirements.

Aluminum Nitride Powder

Aluminum nitride powder is an inorganic compound powder composed of nitrogen and aluminum elements, with the chemical formula AlN. It serves as the fundamental raw material for manufacturing high-performance aluminum nitride ceramic products. Due to its unique combination of properties, it plays a crucial role in modern industry, particularly in electronics and thermal management fields.

Core Characteristics

The ceramic material formed after sintering aluminum nitride powder exhibits the following outstanding properties, which also determine its application directions:
Extremely High Thermal Conductivity
This is the most notable advantage of aluminum nitride. Its theoretical thermal conductivity is as high as 200-260 W/(m·K), which is 5-10 times that of aluminum oxide ceramics, comparable to metallic aluminum, and even superior to some steels. This makes it an excellent thermal management material.
Excellent Electrical Insulation
It combines high thermal conductivity with high electrical insulation, a combination that most metal materials cannot achieve, making it irreplaceable in electronic circuits requiring insulated heat dissipation.
Thermal Expansion Coefficient Matching Silicon
The thermal expansion coefficient of aluminum nitride (4.5×10⁻⁶/°C) is very close to that of silicon (3.5-4×10⁻⁶/°C). This means that when substrates made of aluminum nitride are directly connected to silicon chips, the thermal stress generated during temperature changes is low, significantly improving device reliability and lifespan.
Excellent Mechanical Properties
It possesses high strength, hardness, and Young's modulus, with stable mechanical performance.
Good Chemical Stability
It has good corrosion resistance to most molten metals (such as aluminum, copper, silver, etc.). However, it is prone to hydrolysis reaction with water vapor in high-temperature and humid environments, which is an issue that needs attention during storage and processing.
Low Dielectric Constant and Low Dielectric Loss
Suitable for use in high-frequency, high-speed circuits, it can reduce signal transmission delay and loss.

Production Processes

The main methods for large-scale industrial production of aluminum nitride powder are:
Carbothermal Reduction Method:
This is the most mainstream and mature industrial method. Aluminum oxide powder (Al₂O₃) is mixed with carbon powder (C) and reacted in a nitrogen (N₂) atmosphere at high temperatures of 1600-1800°C to produce AlN. This method has relatively low costs and is easy to scale up, but the product may contain residual carbon impurities.
Direct Nitridation Method:
High-purity aluminum powder is directly reacted with nitrogen or ammonia gas at high temperatures to generate AlN. This method has a simple process, but the reaction is violently exothermic and difficult to control. The product tends to agglomerate and requires subsequent crushing, which may introduce impurities.
Chemical Vapor Deposition (CVD):
This method can produce high-purity, ultra-fine nano-grade AlN powder, but the cost is high, and it is mainly used for laboratory research or special applications.

Aluminum Nitride Powder Application

Our aluminum nitride powder has high purity, small particle size, uniform distribution, large specific surface area, high surface activity, low bulk density, good dispersibility and injection molding properties. It can be used in the following situations:
1. High thermal conductivity filler for thermal conductive paste and thermal conductive silicone grease;
2. High thermal conductivity filler for thermal conductive adhesive, thermal conductive silica gel sheet and epoxy resin thermal conductive potting adhesive;
3. High thermal conductivity filler for thermal engineering plastics;
4. For fixing film, polyimide film high thermal conductivity filler;
5. High thermal conductive fillers for packaging materials, high temperature lubricants, adhesives, heat dissipation paints and heat dissipation inks;
6. Used for manufacturing insulation and thermal conductive filler of high thermal conductivity integrated circuit substrate (MCPCB, FCCL);
7. High thermal conductivity filler for thermal conductive interface material (TIM);
8. Used for crucible metal melting, evaporation boat, ceramic cutting tools, cutting tools, microwave dielectric materials;
9. Used for manufacturing high thermal conductivity aluminum nitride ceramic substrate, aluminum nitride target, and various ceramic products;
10. It can be used for conductive ceramic evaporation boat, and can be compounded with TiB2, BN and other materials;
11. Used to synthesize high quality LED phosphor.

Spherical Aluminum Nitride Powder

Spherical aluminum nitride powder is a powdered product produced by processing ordinary irregularly shaped aluminum nitride powder into spherical form through specific physical or chemical methods. It retains the excellent inherent properties of aluminum nitride (AlN), such as high thermal conductivity and high electrical insulation, while also acquiring new physical characteristics through "spheroidization."

Core Characteristics and Advantages

Extremely High Packing Density and Flowability
Advantage: Spherical particles resemble ball bearings in a bearing, with minimal friction between them, giving the powder excellent flowability. This is crucial for applications like automated feeding and 3D printing.
Advantage: Spherical particles can achieve the tightest packing, leaving fewer voids.
High Filling Density and Low Viscosity
Advantage: When used as a filler in polymer materials (such as epoxy resin or silicone), spherical particles enable a higher filler loading at the same volume fraction and significantly reduce the viscosity of the composite material. This means:
More filler can be added, thereby greatly enhancing the thermal conductivity of the composite material.
The lower viscosity of the mixture improves processability, making operations like injection molding and potting easier.
Isotropic Properties
Advantage: Spherical particles have uniform properties in all directions. Composite materials made from them exhibit better isotropy in terms of thermal expansion, thermal conductivity, and mechanical properties. This avoids performance differences due to orientation and improves product reliability and consistency.
Smooth Surface and Uniform Stress Distribution
Advantage: The smooth spherical surface reduces stress concentration points. During ceramic sintering, this helps achieve a denser sintered body with fewer defects, improving the mechanical strength and thermal conductivity of the ceramic. In composite materials, it also reduces internal stress and enhances product durability.

Spec.	Purity	Shape	Available
AlN-ES001	＞95%	Spherical	D50 1-3 um
AlN-ES005	＞95%	Spherical	D50 5±1 um
AlN-ES010	＞95%	Spherical	D50 10±2 um
AlN-FS030	＞95%	Spherical	D50 30±3 um
AlN-MS050	＞95%	Spherical	D50 50±5 um
AlN-MS080	＞95%	Spherical	D50 80±5 um
AlN-MS100	＞95%	Spherical	D50 100±5 um
AlN-MS120	＞95%	Spherical	D50 120±5 um
AlN-CS150	＞95%	Spherical	D50 150±10 um
Customizable	＞95%	Customizable	Sieve as required

Applications

Due to its exceptional performance, spherical aluminum nitride powder primarily targets high-end fields with extremely high-performance requirements:
High-End Thermal Interface Materials and Encapsulants
Used to manufacture thermal greases, thermal gels, thermal pads, and encapsulating epoxy resins with ultra-high thermal conductivity. It serves as a core filler for thermal management in high-power devices such as 5G base stations, high-performance computing (HPC) chips, and artificial intelligence (AI) accelerator cards.
Sintering of High-Performance Ceramic Substrates and Components
Used in preparing slurries for tape casting. The high packing density of spherical powder helps the green body achieve a sintered ceramic body close to theoretical density during sintering, thereby fully realizing the high thermal conductivity potential of aluminum nitride. It is used for substrates in high-power LEDs, IGBTs, and lasers.
3D Printing Materials
In 3D printing technologies like Selective Laser Sintering (SLS), powder flowability is critical for success. Spherical AlN powder is an ideal material for printing heat sinks with complex shapes (such as embedded heat sinks and conformal cooling channels).
Thermally Conductive Engineering Plastics
Added to engineering plastics like PPS, PA, and PC to create plastic components with excellent heat dissipation capabilities. These are used in lightweight, high-heat-dissipation electronic housings, automotive parts, etc.

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