Aluminum Nitride Powder Price & List
| Product Name |
Purity |
Shape |
Grade |
Partcile Size |
| N-AlN |
99% - 99.999% |
Spherical, flake, irregular, etc. |
Nanopowder |
5 - 100 nm |
| U-AlN |
99% - 99.999% |
Spherical, flake, irregular, etc. |
Ultra Fine |
0.1 - 0.5 um |
| E-AlN |
99% - 99.999% |
Spherical, flake, irregular, etc. |
Extremely Fine |
0.5 - 10 um |
| F-AlN |
99% - 99.999% |
Spherical, flake, irregular, etc. |
Fine |
10 - 44 um |
| M-AlN |
99% - 99.999% |
Spherical, flake, irregular, etc. |
Medium |
44 - 150 um |
| C-AlN |
99% - 99.999% |
Spherical, flake, irregular, etc. |
Coarse |
150 - 250 um |
Note: We provide customized service. If you don't find the powder you want, please send us an email directly. We can customize it according to your requirements.
Aluminum Nitride Powder
Aluminum nitride powder is a kind of ceramic material with high thermal conductivity and excellent electrical insulation properties. The aluminum nitride powder produced by us has high purity, small particle size, uniform distribution, large specific surface area, high surface activity, low bulk density, good dispersion and injection molding properties. It can be used in composite materials with good matching with semiconductor silicon and good interface compatibility, It can improve the mechanical properties, thermal conductivity and dielectric properties of the composites.
We mainly provide nano aluminum nitride powder, micro ultra-fine aluminum nitride powder.
Aluminum Nitride Powder Application
Our aluminum nitride powder has high purity, small particle size, uniform distribution, large specific surface area, high surface activity, low bulk density, good dispersibility and injection molding properties. It can be used in the following situations:
1. High thermal conductivity filler for thermal conductive paste and thermal conductive silicone grease;
2. High thermal conductivity filler for thermal conductive adhesive, thermal conductive silica gel sheet and epoxy resin thermal conductive potting adhesive;
3. High thermal conductivity filler for thermal engineering plastics;
4. For fixing film, polyimide film high thermal conductivity filler;
5. High thermal conductive fillers for packaging materials, high temperature lubricants, adhesives, heat dissipation paints and heat dissipation inks;
6. Used for manufacturing insulation and thermal conductive filler of high thermal conductivity integrated circuit substrate (MCPCB, FCCL);
7. High thermal conductivity filler for thermal conductive interface material (TIM);
8. Used for crucible metal melting, evaporation boat, ceramic cutting tools, cutting tools, microwave dielectric materials;
9. Used for manufacturing high thermal conductivity aluminum nitride ceramic substrate, aluminum nitride target, and various ceramic products;
10. It can be used for conductive ceramic evaporation boat, and can be compounded with TiB2, BN and other materials;
11. Used to synthesize high quality LED phosphor.
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